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ASE to expand WLCSP capacity at Singapore plant, sources say

Julian Ho, Singapore; Jessie Shen, DIGITIMES Asia Tuesday 21 November 2017 0

In the wake of robust demand for wearable devices and automotive electronics applications, packaging and testing company Advanced Semiconductor Engineering (ASE) is set to expand wafer-level chip-scale-package (WLCSP) production capacity at its plant...

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