CONNECT WITH US

ASE gearing up for HPC chip boom

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia 0

Credit: DIGITIMES

OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including AMD, Broadcom and MediaTek, according to industry sources.

The article requires paid subscription. Subscribe Now