ASE Technology and other OSATs continue to experience low production utilization rates for flip-chip (FC) packaging, due to sluggish demand for handset ICs, according to industry sources.
The article requires paid subscription. Subscribe Now
Credit: DIGITIMES
ASE Technology and other OSATs continue to experience low production utilization rates for flip-chip (FC) packaging, due to sluggish demand for handset ICs, according to industry sources.