These are the most-read DIGITIMES Asia stories in the week of August 12 – August 16.
Japanese breakthrough in energy-efficient EUV tech could propel advances in the field
Japanese researchers at the Okinawa Institute of Science and Technology (OIST) have developed a groundbreaking new technology that dramatically reduces the cost and energy consumption of EUV lithography machines. This breakthrough could revolutionize the semiconductor industry and potentially disrupt the market dominated by a single major player, namely the Dutch company ASML.
China gaining self-sufficiency in semiconductor equipment, but crucial exposure tools remain constrained
As a result of US chip export sanctions, China has become increasingly self-sufficient in semiconductor manufacturing equipment in recent years, with companies such as AMEC and Naura rapidly expanding their reach. However, exposure machines, the most critical piece of equipment used in the semiconductor manufacturing process, remain a major hurdle to China's semiconductor industry's ultimate self-reliance.
China's foundries surge ahead: SMIC and Hua Hong at full capacity amidst rising domestic demand
China's leading wafer foundries, SMIC and Hua Hong Semiconductor, have seen their newly added 12-inch production capacity fully utilized, absorbing a surge in domestic orders. The surge is attributed to prices stabilizing and domestic IC clients shifting production to local supply chains due to peak season demand. As a result, both companies are operating at full capacity, with their production lines nearing 100% utilization.
Taiwan stands firm to keep advanced semiconductor R&D despite US pressure
The US has reportedly been pressuring Taiwan to amend its laws to allow TSMC to produce chips using the most advanced process node technology on American soil, a request that also includes relocating TSMC's R&D team to America. Despite the pressure from the US, Cheng-wen Wu, minister of the National Science and Technology Council (NSTC), stated in an interview with DIGITIMES Asia that they remain steadfast in keeping TSMC's semiconductor R&D work within Taiwan.
Daxin develops chipmaking materials for 2nm, CoWoS
Daxin Materials, a company under LCD panel maker AU Optronics (AUO) that provides specialty chemicals for semiconductors, display, and key raw materials, has developed chipmaking materials supporting advanced 2nm manufacturing processes and CoWoS packaging. Both the 2nm processes and CoWoS materials are undergoing verification, with the latter expected to take longer, and thus unlikely to contribute revenue in 2024. Despite this, the company remains cautiously optimistic about sales for 2024.
Why Intel has also struggled to manufacture chips in Arizona
TSMC's Fab 21 in Arizona recently received concerns from The New York Times regarding the delay of chip fabrication and sale despite the project being announced four years ago. However, a DIGITIMES report highlighted that the issue is not just limited to TSMC but Intel's gigafab complex in Arizona as well. The report indicated that Intel's progress is arguably lagging even further behind TSMC's, as Intel has yet to set a milestone for the first tool-in at its Arizona fabs while TSMC reached its first tool-in milestone in December 2022.
Intel's CHIPS Act implementation hamstrung by performance, packaging dependencies, and workforce shortages
The US$39 billion funding allocation under the CHIPS and Science Act (CHIPS Act) is nearing completion. However, for Intel, greater challenges lie in revitalizing the domestic semiconductor manufacturing supply chain. This includes the company's operational difficulties, a continued reliance on Asia for packaging, a shortage of skilled labor, and environmental factors. Despite these challenges, Intel CEO Pat Gelsinger stated that he remains committed to their wafer manufacturing product roadmap.
