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TSMC accelerates Fab AP8 project for CoWoS advanced packaging

Monica Chen, Hsinchu; Rodney Chan, DIGITIMES Asia Friday 11 October 2024 0

Credit: DIGITIMES

TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry house for making its AI chips, according to industry sources.

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