Winbond to open new fab in southern Taiwan by 2021

Siu Han, Taipei; Jessie Shen, DIGITIMES Asia Monday 17 June 2019 0

Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed 20nm process technology ready for commercial production.

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